The board
- Hours
- Full time
- Where
- Santa Clara, CA
- Posted
- Sep 5
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs.
What you'd do
- Perform signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulations for advanced packaging and high-speed interconnects.
- Evaluate package and PCB designs to ensure electrical performance requirements are met.
- Analyze power distribution networks (PDNs) and high-speed channels to identify and resolve signal and power delivery issues.
- Execute simulation and verification activities supporting SI/PI sign-off.
- Collaborate with package design, layout, hardware, and IP teams to optimize electrical performance.
- Develop scripts and automation tools using Python, MATLAB, or similar tools to improve analysis workflows.
- Document results and present technical findings to cross-functional engineering teams.
What they want
- Currently enrolled in a Master's Degree program studying Electrical Engineering, Computer Engineering, or a related discipline, with an expected graduation date between Fall 2027 – Summer 2028.
- Strong interest in hardware design and strong understanding of electromagnetic fundamentals, signal integrity concepts and circuit simulation techniques.
- Knowledge of circuit simulation techniques and experience evaluating electrical behavior of package, PCB, or interconnect structures.
- Exposure to frequency-domain and time-domain analysis methodologies.
- Experience with electrical simulation tools for signal integrity, power integrity, or electromagnetic analysis.
- Ability to organize technical information, analyze data, document results, and communicate findings effectively.
- Strong collaboration skills and the ability to work with engineers across multiple disciplines, teams, and locations.
- Interest in hardware design, advanced packaging technologies, and design optimization.
- Starts
- 2026-09-05