The board
- Hours
- Full time
- Where
- Boise, ID - Main Site
- Posted
- Aug 17
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
At Micron, our vision is to transform how the world uses information to enrich life for all. The Technology Development (R&D) organization is responsible for developing innovative memory and storage technologies that enable next-generation semiconductor products.
What you'd do
- Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
- Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
- Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
- Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
- Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.Minimum Qualifications
- Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
- Demonstrated understanding of wafer bonding principles and semiconductor processing applications.
- Research, laboratory, internship, or project experience in a semiconductor-related field.
- Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
- Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.Preferred Qualifications
- Starts
- 2026-08-13