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Internship
Design

Intern - PHY Digital Design & Automation Engineer, HBM

Micron

Hours
Full time
Where
Richardson, TX
Posted
2 days ago

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

What you'd do

  • Support digital design, integration, and timing analysis activities for HBM PHY and IO subsystems, including timing constraint development and timing closure efforts.
  • Develop and implement verification solutions using Verilog/SystemVerilog and UVM-based environments, analyze simulation results, and debug functional or timing-related issues.
  • Create Python-based automation tools and AI Assisted engineering workflows that leverage Large Language Models (LLMs) and Generative AI technologies to improve engineering efficiency.
  • Collaborate with architecture, design, verification, and product engineering teams to evaluate features, validate architectures, and improve design quality metrics.
  • Document technical findings and present results through design reviews, engineering discussions, and project presentations.

What they want

  • Currently pursuing a Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • Demonstrated understanding of digital design concepts including finite state machines (FSMs), pipelining, clock-domain crossing (CDC), timing analysis, and computer architecture.
  • Experience with RTL design and verification concepts using Verilog or SystemVerilog.
  • Proficiency in Python, C++, or a comparable programming language, and experience working in Linux-based development environments.
  • Strong analytical, debugging, problem-solving, written communication, and verbal communication skills.

About Micron

At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops future High-Bandwidth Memory (HBM) architectures, PHY design methodologies, and automation solutions that enable next-generation AI, high-performance computing, networking, and data center applications.

Starts
2026-09-14